22-Oct-2022 | Strategic partners participate in investment and compound component cooperation plans |
22-Sep-2022 | Ultra-high voltage (3300V~6600V) SiC research and development verification |
22-Aug-2022 | GaN IC engineering sample test verification |
22-Jun-2022 | Mass production of the first SiC MOSFET |
22-May-2022 | Ultra small package (1.2x1.2mm) DC-DC |
22-Mar-2022 | Mass production of the first AC-DC power conversion IC |
22-Feb-2022 | Mass production of the first SiC SBD |
20-Oct-2022 | Compound Semiconductor Laboratory Preparatory Office was established |
20-Aug-2022 | Verification of ultra-high PF and high-efficiency multi-stage LED driver IC completed |
20-Jul-2022 | Small package HV DC-DC (563) |
19-Mar-2022 | Mass production of low static power step-down DC-DC |
19-Feb-2022 | Mass production of low static power consumption booster IC |
18-May-2022 | Mass production of the first load switch IC |
17-Oct-2022 | Mass production of high-voltage ultra-low power consumption LDO |
16-Sep-2022 | First MOSFET design put into production |
14-Jun-2022 | Mass production of the first high voltage boost IC |
14-Mar-2022 | Mass production of the first ultra-low voltage boost IC |
13-Dec-2022 | Mass production of ultra-tiny package (1x1mm) LDO |
13-Oct-2022 | Mass production of high voltage DC-DC with input overvoltage protection |
09-Feb-2022 | Mass production of the first high-voltage DC-DC |
08-Dec-2022 | White LED driver IC completed |
08-Mar-2022 | Mass production of the first DC-DC |
07-Mar-2022 | Mass production of the first LDO product |
06-May-2022 | Founded |